PV07000 - SEMI PV70 - Test Method for In-Line Measurement of Saw Marks on Photovoltaic (PV) Silicon Wafers by Laser Triangulation Sensors StdPbc-0322 granularity

granularity

本文書は，自動および手動での基板搬送についてホストが情報を知り，その役割を果たし易くするスタンダードを定義するものである。また，製造装置における材料処理を制御するために有用になることも意図としている。具体的には，以下の内容を提供する。

the following equipment types:

SEMI E30-0996 (technical revision)

PV07000 - SEMI PV70 - Test Method for In-Line Measurement of Saw Marks on Photovoltaic (PV) Silicon Wafers by Laser Triangulation Sensors StdPbc-0322 granularityThis Standard was technically approved by the Photovoltaic Materials Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on December 4, 2015. Available at www. semiviews. org and www. semi. org in January 2016. Silicon (Si) wafers for PV applications cut from a Si ingot or Si brick by multiple wire sawing contain artifacts characteristic for this cutting process, so called saw marks. The