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This Document accomplishes this by defining an operational model for prober equipment as viewed by a factory automation controller
1-0304 (technical revision)
The edges of circular wafers of electronic materials are frequently required to be shaped after cutting the wafers from the ingot
SEMI MF1528-0413 (Reapproved 1018)
M06800 - SEMI M68 - Test Method for Determining Wafer Near-Edge Geometry from a Measured Height Data Array Using a Curvature Metric, ZDD Revision:SEMI M68-0720 - Current This Document accomplishes this byWafer near edge geometry can significantly affect the yield of semiconductor device processing. Knowledge of near edge geometrical properties can help the producer and consumer determine if the dimensional characteristics of a specimen wafer satisfy given geometrical requirements. The metric, ZDD, quantifies the near edge curvature of wafers used in semiconductor device processing. Consideration should be given to the use of this or other proposed
